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Bare Rigid Flexible Printed Circuit Board Soldering Bom Pcb Assembly

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Bare Rigid Flexible Printed Circuit Board Soldering Bom Pcb Assembly

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Brand Name : YDY

Model Number : M-025

Certification : ISO13485, IATF16949, ISO9001,IOS14001

Place of Origin : China

MOQ : 1pcs

Price : Negotiable

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 50000pcs/month

Delivery Time : 1-15 working days

Packaging Details : Vacuum packing or Anti-static package,Outer:export carton or according to the customer's requirement.

Service : Flex PCBA PCB

Type : Multilayer Film Rigid Flexible PCB Materials Sourcing Circuit Board Assembly

Surface : HASL Lf/Enig/OSP

Copper thickness : 0.3-3oz

Min. line width : 0.075mm/0.1mm(3mil/4mil)

Max finished copper thickness : 10 OZ (350um)

Layer : Double layer RFPC

Layer Count : 1Layer-32Layer

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Multilayer Film Rigid Flexible PCB Materials Sourcing Circuit Board Assembly

YDY offers complete solutions for product:

• SMT & PTH & BGA PCBA, PCB Board assembly

• PCBA and enclosure design

• Components sourcing and purchasing

• Double Sided PCB Manufacturing Process

• Plastic injection molding

• Metal sheet stamping

• Final assembly

• Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)

• Custom clearance for material importing and product exporting

• Gerber File And BOM List PCBA

• PCBA copy

• PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board

Our service:


1.Professional engineer team --help you to check design and do engineering before production.
2.After-sales service--every problem you have will get our professional advice and solution.
3.Constant follow up-- make us have the fast reaction of your requirement.
4.Perfect FPC production industry--provide high quality and competitive price FPC.
5.Inspection agency--has the most authoritative UL and ISO inspection agencies in the world.

Rigid Flexible PCB Capability

NO
Item
Process capability
1
product type
FR-4, High Tg, Aluminium, Copper PCB, Ceramic PCB, Polyimide PCB, Rigid-flex PCB
2
Max layer count
20 layers
3
Min base copper thickness
1/3 OZ (12um)
4
Max finished copper thickness
10 OZ (350um)
5
Min trace width/spacing(Inner layer)
2/2mil (0.05mm)
6
Min trace width/spacing(Outer layer)
2/2mil (0.05mm)
7
Min spacing between hole to inner layer conductor
6mil (0.15mm)
8
Min spacing between hole to outer layer conductor
6mil (0.15mm)
9
Min annular ring for via
4mil (0.1mm)
10
Min annular ring for component hole
4mil (0.1mm)
11
Min BGA diameter
4mil (0.1mm)
12
Min BGA pitch
4mil (0.1mm)
13
Min hole size
0.15mm(CNC); 0.1mm(Laser)
14
Max aspect ratios
8.01
15
Min soldermask bridge width
4mil (0.1mm)
16
Soldermask/circuit processing method
Film
17
Min thickness for insulating layer
1mil (0.025mm)
18
HDI & special type PCB
HDI(1-3 steps), R-FPC(2-16 layers), High frequency mix-pressing(2-14 layers), Buried capacitance & resistance, 0.14mm to 0.2mm
extra thinner pcb,high heat conducting thermoelectric separation copper based pcb, etc
Product Tags:

Rigid Printed Circuit Board

      

bare rigid printed circuit board

      

Rigid Printed Circuit Boards

      
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