High Speeds THT DIP PCBA Multilayer PCB Assembly Through Hole Pcb Assembly.
YDYPCBA service include :
SMT, Through-hole & Mixed Technology , Single & Double Sided SMT Assembly
Leaded & Lead Free (RoHS) Assembly
No-Clean & Water Soluble Fluxes
Standard Flux: Water Soluble
PCBA Testing Services
Conformal Coating
Rework Services
SMT Sizes: 0201 or greater
BGA Pitch: 16 mil (0.4mm) or greater
Fine Pitch: 16 mil (0.4mm) or greater
Ball Grid Array (BGA & µBGA), QFN, POP &
lead-less chips
Wire & Cable Harnesses
Class II and Class III Inspection
Visual, Automatic Optical & X-ray Inspection
Box Build
Through-hole assembly provides a more robust mechanical bond between the circuit board and the application. Enhanced strength and security make through-hole assembly the preferred option for manufacturers in aerospace and military sectors.
- Through-hole PCB assembly is well suited to:
- Applications that must endure high levels of stress
- Applications that must operate at high speeds
- Applications that must operate at extreme temperatures, both hot and cold
- Applications that must operate in high-voltage conditions
- Fast and straightforward prototyping
PCB Manufacture Capacity
| Service type | High Speeds THT DIP PCBA Multilayer PCB Assembly Through Hole Pcb Assembly. |
| Material | HAL(with Pb free),plated Ni/Au, Immersion silver,Imm Ni/Au,Imm Sn, hard gold,OSP,ect |
| Surface Finish | HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek) |
| Finish Board Thickness | 0.2mm-6.00 mm(8mil-126mil) |
| Min.board thickness(multilayer) | 4layers:0.4mm;
6layers:0.6mm;
8layers:1mm;
10layers:1.2mm |
| Copper Thickness | 1/2 oz min;12 oz max |
| Solder Mask | Green/Black/White/Red/Blue/Yellow |
| Min.Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
| Min.Hole Diameter for punching | 0.9mm(35mil) |
| Biggest panel size | 610mm*508mm |
| Hole Positon | +/-0.075mm(3mil) CNC Driling |
| Conductor Width(W) | 0.05mm(2mil)or; +/-20% of original artwork |
| Hole Diameter(H) | PTH L:+/-0.075mm(3mil); Non-PTH L:+/-0.05mm(2mil) |
| Outline Tolerance | 0.125mm(5mil) CNC Routing; +/-0.15mm(6mil) by Punching |
| Insulation Resistance | 10Kohm-20Mohm |
| Conductivity | <50ohm |
| Test Voltage | 10-300V |
| Panel Size | 110×100mm(min);660×600mm(max) |
| Layer-layer misregistration | 4 layers:0.15mm(6mil)max; 6 layers:0.25mm(10mil)max |
| Min.spacing between hole edge to circuity pqttern of an inner layer | 0.25mm(10mil) |
| Min.spacing between board oulineto circuitry pattern of an inner layer | 0.25mm(10mil) |
| Board thickness tolerance | 4 layers:+/-0.13mm(5mil); 6 layers:+/-0.15mm(6mil) |
| Impedance Control | +/-10% |
Through Hole Technology Process Steps
Component placement: For THT, the component leads or pins are inserted through the board.
Inspection and correction: Any errors in placement will be corrected here.
Wave soldering: For wave soldering, one side of the entire board is exposed to a “wave” of solder. As the board traverses the wave, the through-hole components are soldered simultaneously.
Quality Assurance:
Our Quality processes include:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, TS 16949, UL
We provide through-hole PCB assembly services to meet conventional lead assembly requirements of a variety of industries. We provide single, double-sided, and high-density multilayer PCB Through Hole (PTH) circuit board assembly services to meet our clients’low to mid-volume production requirements.
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